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added silicon chip, fixed some circuitry recipes
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Trinsdar committed Aug 2, 2023
1 parent c0ed7c6 commit 80c0ce9
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Showing 3 changed files with 12 additions and 2 deletions.
Original file line number Diff line number Diff line change
Expand Up @@ -182,6 +182,7 @@ public static void init(Side side) {
public static ItemBasic<?> NaquadahDopedSiliconBoule = new ItemBasic<>(GTIRef.ID, "naquadah_doped_monocrystalline_silicon_boule", "silicon/");

public static ItemBasic<?> Wafer = new ItemBasic<>(GTIRef.ID, "wafer", "silicon/");
public static ItemBasic<?> SiliconChip = new ItemBasic<>(GTIRef.ID, "silicon_chip", "silicon/");
public static ItemBasic<?> GlowstoneDopedWafer = new ItemBasic<>(GTIRef.ID, "glowstone_doped_wafer", "silicon/");
public static ItemBasic<?> NaquadahDopedWafer = new ItemBasic<>(GTIRef.ID, "naquadah_doped_wafer", "silicon/");

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13 changes: 11 additions & 2 deletions common/src/main/java/muramasa/gregtech/loader/items/Circuitry.java
Original file line number Diff line number Diff line change
Expand Up @@ -36,7 +36,7 @@ public static void init() {
.fi(DistilledWater.getLiquid(721))
.io(new ItemStack(Wafer, 16)).add("wafer_with_distilled_water", 1600, 384);
CUTTING.RB().ii(RecipeIngredient.of(SiliconBoule, 1))
.fi(DistilledWater.getLiquid(240))
.fi(Lubricant.getLiquid(240))
.io(new ItemStack(Wafer, 16)).add("wafer_with_lubricant", 800, 384);
//Coated
ASSEMBLING.RB().ii(of(GTRubberData.StickyResin,1), of(PLATE.get(AntimatterMaterials.Wood),8))
Expand All @@ -50,6 +50,15 @@ public static void init() {
}

private static void boards(){
CUTTING.RB().ii(RecipeIngredient.of(Wafer, 1))
.fi(FluidPlatformUtils.createFluidStack(Fluids.WATER, 960 * TesseractGraphWrappers.dropletMultiplier))
.io(new ItemStack(SiliconChip, 8)).add("silicon_chip_with_water", 1600, 384);
CUTTING.RB().ii(RecipeIngredient.of(Wafer, 1))
.fi(DistilledWater.getLiquid(721))
.io(new ItemStack(SiliconChip, 8)).add("silicon_chip_with_distilled_water", 1600, 384);
CUTTING.RB().ii(RecipeIngredient.of(Wafer, 1))
.fi(Lubricant.getLiquid(240))
.io(new ItemStack(SiliconChip, 8)).add("silicon_chip_with_lubricant", 800, 384);
ASSEMBLING.RB().ii(of(Wafer), PLATE.getMaterialIngredient(Polyethylene, 1)).io(new ItemStack(CircuitBoardEmpty)).add("empty_circuit_board", 32, 16);
ASSEMBLING.RB().ii(of(CircuitBoardCoated), PLATE.getMaterialIngredient(Polyethylene, 1)).io(new ItemStack(CircuitBoardEmpty)).add("empty_circuit_board_1", 32, 16);
PRESSING.RB().ii(of(CircuitBoardEmpty), of(EtchedWiringMV, 4)).io(new ItemStack(CircuitBoardBasic)).add("basic_circuit_board", 32, 16);
Expand Down Expand Up @@ -78,7 +87,7 @@ private static void circuits(){
ASSEMBLING.RB().ii(of(CircuitBoardAdvanced), of(AdvCircuitParts, 2)).fi(Lead.getLiquid(L * 2)).io(new ItemStack(CircuitAdv)).add("adv_storage_circuit_lead", 32, 64);
ASSEMBLING.RB().ii(of(CircuitBoardAdvanced), of(EngravedCrystalChip)).fi(Tin.getLiquid(L)).io(new ItemStack(CircuitDataStorage)).add("data_storage_circuit_tin", 32, 64);
ASSEMBLING.RB().ii(of(CircuitBoardAdvanced), of(EngravedCrystalChip)).fi(SolderingAlloy.getLiquid(L / 2)).io(new ItemStack(CircuitDataStorage)).add("data_storage__circuit_soldering_alloy", 32, 64);
ASSEMBLING.RB().ii(of(CircuitBoardAdvanced), of(EngravedCrystalChip)).fi(Lead.getLiquid(L * 2)).io(new ItemStack(CircuitAdv)).add("data_storage_circuit_lead", 32, 64);
ASSEMBLING.RB().ii(of(CircuitBoardAdvanced), of(EngravedCrystalChip)).fi(Lead.getLiquid(L * 2)).io(new ItemStack(CircuitDataStorage)).add("data_storage_circuit_lead", 32, 64);
ASSEMBLING.RB().ii(of(CircuitBoardProcessor), of(CircuitDataStorage, 3)).fi(Tin.getLiquid(L * 2)).io(new ItemStack(CircuitDataControl)).add("data_control_circuit_tin", 32, 256);
ASSEMBLING.RB().ii(of(CircuitBoardProcessor), of(CircuitDataStorage, 3)).fi(SolderingAlloy.getLiquid(L)).io(new ItemStack(CircuitDataControl)).add("data_control_circuit_soldering_alloy", 32, 256);
ASSEMBLING.RB().ii(of(CircuitBoardProcessor), of(CircuitDataStorage, 3)).fi(Lead.getLiquid(L * 4)).io(new ItemStack(CircuitDataControl)).add("data_control_circuit_lead", 32, 256);
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