made advanced circuit parts able to take a lapis plate

GregTech-Intergalactical · Aug 1, 2023 · 39ab602 · 39ab602
1 parent 92090d1
commit 39ab602
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diff --git a/common/src/main/java/muramasa/gregtech/data/GregTechMaterialEvents.java b/common/src/main/java/muramasa/gregtech/data/GregTechMaterialEvents.java
@@ -1623,7 +1623,7 @@ private static void antimatterMaterials(GregTechMaterialEvent event){
         event.setMaterial(Gold).flags(FOIL, ROD, WIRE_FINE, GEAR);
         event.setMaterial(Iron).flags(RING, GEAR, FRAME);
         event.setMaterial(AntimatterMaterials.Netherite).asMetal(2246, 1300);
-        event.setMaterial(Lapis).asGemBasic(false).mats(of(Lazurite, 12, Sodalite, 2, Pyrite, 1, Calcite, 1));
+        event.setMaterial(Lapis).asGemBasic(false, PLATE).mats(of(Lazurite, 12, Sodalite, 2, Pyrite, 1, Calcite, 1));
         event.setMaterial(Prismarine).mats(of(Potassium, 2, Oxygen, 8, Manganese, 1, Silicon, 5));
         event.setMaterial(Redstone).mats(of(Silicon, 1, Pyrite, 5, Ruby, 1, Mercury, 3)).asFluid(0, MaterialTags.MELTING_POINT.getInt(Redstone));//.setOreMulti(4);
         event.setMaterial(Water).mats(of(Hydrogen, 2, Oxygen, 1)).elecTicks(2000);

diff --git a/common/src/main/java/muramasa/gregtech/loader/items/Circuitry.java b/common/src/main/java/muramasa/gregtech/loader/items/Circuitry.java
@@ -12,6 +12,7 @@
 
 import static muramasa.antimatter.Ref.L;
 import static muramasa.antimatter.data.AntimatterMaterialTypes.*;
+import static muramasa.antimatter.data.AntimatterMaterials.Lapis;
 import static muramasa.gregtech.data.GregTechData.*;
 import static muramasa.gregtech.data.GregTechMaterialTags.SOLDER;
 import static muramasa.gregtech.data.Materials.*;
@@ -34,6 +35,7 @@ private static void boards(){
         PRESSING.RB().ii(of(CircuitBoardProcessorEmpty), of(EtchedWiringEV, 4)).io(new ItemStack(CircuitBoardProcessor)).add("processor_circuit_board", 32, 256);
         ASSEMBLING.RB().ii(PLATE.getMaterialIngredient(Silicon, 2), PLATE.getMaterialIngredient(Polytetrafluoroethylene, 1)).io(new ItemStack(CircuitBoardProcessorEmpty)).add("empty_processor_circuit_board", 32, 256);
         ASSEMBLING.RB().ii(PLATE.getMaterialIngredient(Lazurite, 1), DUST.getMaterialIngredient(AntimatterMaterials.Glowstone, 1)).io(new ItemStack(AdvCircuitParts, 2)).add("advanced_circuit_parts", 32, 64);
+        ASSEMBLING.RB().ii(PLATE.getMaterialIngredient(Lapis, 1), DUST.getMaterialIngredient(AntimatterMaterials.Glowstone, 1)).io(new ItemStack(AdvCircuitParts, 2)).add("advanced_circuit_parts", 32, 64);
         ASSEMBLING.RB().ii(PLATE.getMaterialIngredient(Polyethylene, 1), of(WIRE_RED_ALLOY.getBlockItem(PipeSize.VTINY), 1)).fi(Tin.getLiquid(L / 4)).io(new ItemStack(NandChip)).add("nand_chip_tin_poly", 32, 16);
         ASSEMBLING.RB().ii(PLATE.getMaterialIngredient(Polyethylene, 1), of(WIRE_RED_ALLOY.getBlockItem(PipeSize.VTINY), 1)).fi(SolderingAlloy.getLiquid(L / 8)).io(new ItemStack(NandChip)).add("nand_chip_soldering_alloy_poly", 32, 16);
         ASSEMBLING.RB().ii(PLATE.getMaterialIngredient(Polyethylene, 1), of(WIRE_RED_ALLOY.getBlockItem(PipeSize.VTINY), 1)).fi(Lead.getLiquid(L / 2)).io(new ItemStack(NandChip)).add("nand_chip_lead_poly", 32, 16);